Final Form - Pro/E Screenshot - This is a screenshot of the final 2-part enclosure. All surfacing was done in Pro/E without ISDX and mold tooling was cut directly from the 3D data.
Displacement Plot - Top Cover Snap - Complete stress and deflection analyses were done using Pro/Mechanica. This plot shows displacement in direction of snap engagement during assembly.
Stress Plot - Top Cover Snap - Complete stress and deflection analyses were done using Pro/Mechanica. This plot shows stress in the snap during assembly.
Displacement Plot - Bottom Cover - Complete stress and deflection analyses were done using Pro/Mechanica. This plot shows displacement of the bottom cover in direction of snap engagement during assembly.
Stress Plot - Bottom Cover - Complete stress and deflection analyses were done using Pro/Mechanica. This plot shows the maximum assembly stress in the bottom cover.
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Handheld Electronics Enclosure
Joe Moak
Sr. Product Design Engineer Santa Barbara, CA